Device unit body containing metal, polyimide and blocking layer structure and fabrication method of device unit body

一种包含有金属、聚酰亚胺及阻挡层结构的器件单元体及制作方法

Abstract

本发明提供一种包含有金属、聚酰亚胺及阻挡层结构的器件单元体及制作方法,所述器件单元体包括衬底、绝缘氧化层、第一金属层、第一二氧化硅层、第一氮化硅层、聚酰亚胺、第二金属层、第二二氧化硅层和第二氮化硅层,其特征在于:所述第一金属层和聚酰亚胺依次被第一二氧化硅层和第一氮化硅层隔开的,第二金属层和聚酰亚胺依次被第二二氧化硅层和第二氮化硅层隔开的。本发明应用在片上螺旋变压器,铜作为电感线圈,聚酰亚胺作为线圈间介质,采用金属铜与聚酰亚胺之间的阻挡层结构,可以有效防止铜扩散到聚酰亚胺中,提高器件的耐压,改善器件的性能。
The invention provides a device unit body containing metal, polyimide and a blocking layer structure and a fabrication method of the device unit body. The device unit body comprises a substrate, an insulation oxide layer, a first metal layer, a first silicon dioxide layer, a first silicon nitride layer, polyimide, a second metal layer, a second silicon dioxide layer and a second silicon nitride layer and is characterized in that the first metal layer and the polyimide are sequentially separated by the first silicon dioxide layer and the first silicon nitride layer, and the second metal layer and the polyimide are sequentially separated by the second silicon dioxide layer and the second silicon nitride layer. The device unit body is applied to an on-chip spiral transformer, copper is taken as an induction coil, and the polyimide is taken as an intercoil medium; and with the adoption of the blocking layer structure between the metal copper and the polyimide, the copper can be effectively prevented from being diffused to the polyimide, the pressure resistance of the device is improved, and the performance of the device is improved.

Claims

Description

Topics

Download Full PDF Version (Non-Commercial Use)

Patent Citations (5)

    Publication numberPublication dateAssigneeTitle
    CN-101409263-AApril 15, 2009友达光电股份有限公司Pixel structure, display panel and method for manufacturing optoelectronic device
    CN-102508376-AJune 20, 2012深圳市华星光电技术有限公司液晶显示面板以及其制造方式
    CN-103123911-AMay 29, 2013友达光电股份有限公司像素结构及其制作方法
    US-5475146-ADecember 12, 1995E. I. Du Pont De Nemours And CompanyEnantioselective hydroformylation
    US-6107165-AAugust 22, 2000Quicklogic CorporationMetal-to-metal antifuse having improved barrier layer

NO-Patent Citations (0)

    Title

Cited By (0)

    Publication numberPublication dateAssigneeTitle