Complex three-dimensional-structure micro-channel machining method

一种复杂三维结构微通道的加工方法

Abstract

本发明公开了一种复杂三维结构微通道的加工方法,以金属粒子作为催化剂,根据所需要成形的三维微通道结构,通过机械外力改变加工件方位和旋转速度,从而控制金属粒子催化剂与加工件的接触位置与运动方向,在氢氟酸和氧化剂的混合溶液的作用下刻蚀加工件,从而加工出所需的复杂三维结构微通道;该方法避开了常规思维,通过借助机械外力,巧妙的且简单的实现了三维结构微通道的制作,成本低,且适应于任意规则的复杂三维结构通道;能够适用于微流控芯片、生物芯片及微电子器件,可用于大批量生产,有较大的推广空间。
The invention discloses a complex three-dimensional-structure micro-channel machining method. By taking metal particles as a catalyst, according to a three-dimensional micro-channel structure needed to be formed, orientation and rotation speed of a machined part are changed through an external mechanical force, so that a contact position and a motion direction of the metal particle catalyst and the machined part are controlled; the machined part is etched under the action of a mixed solution of hydrofluoric acid and an oxidizing agent, so that the needed complex three-dimensional-structure micro-channel is machined. The complex three-dimensional-structure micro-channel machining method avoids the conventional thought, smartly and simply implements the manufacturing of the three-dimensional-structure micro-channel by depending on the external mechanical force with low costs, and is suitable for any regular complex three-dimensional-structure micro-channels; additionally, the method can be suitable for micro-fluidic chips, biological chips and microelectronic devices, can be applied to large-batch production and has a larger promotion space.

Claims

Description

Topics

Download Full PDF Version (Non-Commercial Use)

Patent Citations (5)

    Publication numberPublication dateAssigneeTitle
    CN-1959938-AMay 09, 2007旺宏电子股份有限公司Wet process device for etching wafer, and wet process etching method
    US-2010248449-A1September 30, 2010Georgia Tech Research CorporationMetal-Assisted Chemical Etching of Substrates
    US-2013280908-A1October 24, 2013The Board Of Trustees Of The University Of IllinoisMetal assisted chemical etching to produce iii-v semiconductor nanostructures
    US-2015137321-A1May 21, 2015The Board Of Trustees Of The University Of IllinoisApparatus and method for magnetic-field guided metal-assisted chemical etching
    WO-2014152435-A1September 25, 2014The Board Of Trustees Of The Leland Stanford Junior UniversityHigh aspect ratio dense pattern-programmable nanostructures utilizing metal assisted chemical etching

NO-Patent Citations (0)

    Title

Cited By (2)

    Publication numberPublication dateAssigneeTitle
    CN-106270855-AJanuary 04, 2017广东工业大学Micro hole processing device and micro hole processing method
    CN-106629589-AMay 10, 2017广东工业大学Preparation method for bent nanometer wire array with fully controllable bending angle